Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad
TIF®100 5030-05 Series
TIF®100 5030-05 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Key Features
- High thermal conductivity
- Good softness and fillability
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
Applications
- Telecommunication hardware
- Heat Sinking Housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU
- Display card
- Mainboard/mother board
- Notebook
- Power supply
Technical Specifications of TIF®100 5030-05 Series
| Property |
Value |
Test Method |
| Color |
Blue |
Visual |
| Construction |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
3.2 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) |
65 | 30 |
ASTM 2240 |
| Recommended Operating Temperature (℃) |
-40 to 200 |
- |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
9.0 |
ASTM D150 |
| Volume Resistivity (Ohm-cm) |
＞1.0×10¹² |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity (W/m-K) |
5.0 |
ASTM D5470 | ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging & Lead Time
Packaging Details:
- With PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Meet with customers' requirement - customized
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
Company Profile
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective, and comprehensive thermal management solutions. Our facilities include advanced production equipment, full test equipment, and fully automatic coating production lines capable of producing high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. All products are compliant with UL94 V-0, SGS, and ROHS standards.
How to Place an Order
Q: How do I place an order?
A:
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